Young engineers from CMB Engineering win WorldSkills UK competition

By Jenny Eagle contact

- Last updated on GMT

Chris Renwick, Patrick Devanney and Dominic Trees.
Chris Renwick, Patrick Devanney and Dominic Trees.

Related tags: Engineering, Computer-aided design

A team of young engineers from CMB Engineering has excelled in this year’s Manufacturing Team Challenge category at the national WorldSkills UK competition, winning first prize for the design and production of a remote control forklift.

The WorldSkills competition rewards talent and seeks to increase knowledge across a number of industries by encouraging apprenticeships, skills development and further education for young people starting out in vocational and manufacturing roles.

The young engineers from CMB Engineering will now go on to represent the UK in the global, WorldSkills final, in São Paulo, Brazil, August 11-16, 2015.

Andrew Truelove, general manager, CMB Engineering, said the selection of their team is an outstanding achievement and a fine testament to the value and quality of the apprenticeship schemes at CMB Engineering.

We drive invention within the canmaking industry and we firmly believe in investing the time needed to develop and nurture all of our employees​,” he said.

The CMB Engineering team is made up of Chris Renwick, Patrick Devanney and Dominic Trees. All three members have been trained by CMB Engineering’s apprenticeship scheme, which centres around a four-year program of either electrical or mechanical engineering and includes time spent in formal study at Bradford College or Leeds City College, as well as practical experience working alongside the company’s professional engineering teams.

Participating manufacturing teams were given a design criteria for a motorized forklift truck ahead of the competition and then tasked with manufacturing and assembling, including producing full 2D and 3D CAD drawings of all manufactured parts, electrical circuit drawings and the programmable logic controller (PLC) program.

Related topics: Processing & Packaging

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