Leno adds star power to PACK EXPO

By Jenni Spinner contact

- Last updated on GMT

Comedian and former Tonight Show host Jay Leno will be speaking at PACK EXPO International 2014 on November 3.
Comedian and former Tonight Show host Jay Leno will be speaking at PACK EXPO International 2014 on November 3.

Related tags: Pack expo international

Former late-night TV host Jay Leno will entertain the crowd at PACK EXPO, PMMI’s international packaging and processing conference, with a lively lecture.

The comedian and television presenter, who recently stepped down after hosting The Tonight Show​ for more than two decades, will be speaking at PACK EXPO International in Chicago as part of the show’s Leadership Lecture program on November 3.

Star turn

PMMI: The Association for Packaging and Processing Technologies, is the producer of the event, which features technology exhibits and sessions dedicated to hot industry topics. Jim Pittas, vice president of tradeshows for PMMI, announced the star’s appearance during a PMMI media event this week.

We heard he was out of work​,” Pittas joked. “We figured we’d give him something to do​.”

Leno won’t be the first comedian or TV host to make a PACK EXPO appearance. At PACK EXPO International 2012, conservative Dennis Miller (a comedian who rose to fame on Saturday Night Live​ and later had his own talk show) sparred against left-leaning pundit James Carville during a Leadership Lecture.

Record attendance

According to PMMI organizers, the PACK EXPO International that Leno will be speaking at is going to be one for the record books. Pittas said this year’s show and collocated PHARMA EXPO will welcome 50,000 attendees at 2,000 exhibitors, stretching out over 1.1m net square feet.

With this many exhibiting companies, attendees have the chance to see just about any supplier or any kind of technology they need​,” he said. “It’s a breadth and depth of opportunity you just don’t get anyplace else​.”

PACK EXPO International 2014 is scheduled November 2-5 at Chicago's McCormick Place convention center. Registration is now open for the conference and exposition.

Related topics: Processing & Packaging

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