Latest SIG packaging innovation
Expo in Chicago next month.
SIG Pack Systems will demonstrate anew packaging system at Pack Expo in Chicago next month.The company claims this will start a new trend in the industry.
Known as SIG Systegra, the system is a turnkey packaging line offering controls that integrate motion and logic into one system.
Specification of SIG Systegra was developed following market research and customer surveys. The results, the company claims, mean that SIG Systegra offers a modular system, with synchronised interfaces, a common control platform, and standardised mechanical and electrical modules.
This user-friendly design gives greater control of the packaging process and enables the SIG Systegra system to be tailored to current production needs, therefore lowering corresponding operating costs.
Being modular, the packaging system can undertake product handling at any stage of the packaging process; from the end of the customer's manufacturing process up to, and including, case packaging. For example, when it comes to packaging piece goods in pillow packs, the system will cover product conveyance, quality checks, product distribution, buffering the pieces, infeeding, primary and secondary packaging right through to end-of-line packaging.
Intelligent controls encompasses the operating console, with particular attention being paid to the human-machine interface (HMI).
The control can be linked to a local server, or the Internet, which enables global support and opens the system up to remote maintenance.
The system is suitable for various industries, in dry or wet operation, and is available in three versions, for the highest hygiene requirements, for wash-down or for standard operating environments.
